YAENTEK雅恩信息·SiemensEDA软件授权代理商|PADS|Xpedition|Modelsim|Hypeylynx|Valor|Flotherm|KeilMDK|天瑞绿盾|微软|Office|CAM350代理商

Xpedition Package Designer

芯片封装设计软件

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Xpedition Package Designer高级封装 (HDAP) 设计软件
Xpedition Substrate Integrator

芯片封装设计软件

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Benefits•Rapid hierarchical planning, prototyping and optimization of 2.5/3D heterogeneous assemblies•System connectivity management and visualization with cross-domain pin/signal mapping/shorting and system-level logical verification•User-definable rules for custom optimization of pin and ball-out assignments•System-level predictive SI/PI•Predictive data path flow planning•System Verilog integration•50M+ pin design support•Extensive input and output data formats•System-level LVS/STA verification through Calibre® 3DSTACK•Direct integration with Xpedition Package Designer for detailed implementation
XpeditionPackage Designer

芯片封装设计软件

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Benefits•Supports physical design of High-Density Advanced Packages (HDAP) including FOWLP, 2.5D/3D, silicon and organic interposers, embedded substrate bridges, System-In-Package and modules•Advanced dynamic metal fill with DFM-ready results including multi-pass degassing, metal balancing and offset hatched planes•Real-time design visualization and editing in 2D and 3D•Concurrent multi-user team design and patented “sketch routing” shrinks design cycle•In-design geometry-based DRC Removes/reduces signoff-driven ECOs•Physical IP block reuse leverages proven IP and reduces design time•Direct creation of SI/PI simulation models with integrated 3D EM solver•Fast high-quality mask generation using either GDSII or OASIS•Full mask LVS and package assembly signoff through direct integration with Calibre 3DSTACK Key features•Proven capacity and interactive performance on the largest designs•Multi-user concurrent team design•ODB++ import for legacy design migration•Fast accurate GDSII and OASIS output•Rapid, on-the-fly connectivity creation via Layout Driven Design•2D/3D editing and visualization all within core layout•Patented sketch-routing technology for the industry’s highest routing productivity•Fast, accurate and mask-ready area fill/plane processing including degassing, metal balancing and offset hatched planes•Embedded 3D quasi-static field solver for package model creation•User-customizable geometry DRC engine for in-process verification of complex rules•Direct integration with Calibre for mask signoff, assembly LVS and debug

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